Module lines engineered around the cell architecture they will process, because TOPCon, HJT and BC each demand a different interconnection strategy.
| Cell route | Interconnection method | Key equipment consideration |
|---|---|---|
| TOPCon | Conventional infrared or contact soldering; multi-busbar ribbon | Standard stringer platform; thermal profile tuned for n-type cell handling and reduced bow |
| HJT | Low-temperature joining below roughly 180 °C, infrared soldering with low-temp alloy, conductive film, or wire-based interconnection | Thermal budget is a hard constraint: exceeding it degrades the amorphous silicon passivation and destroys the efficiency advantage |
| BC | Rear-side interconnection, frequently busbar-free (0BB), using patterned conductive backsheet or conductive adhesive | Alignment accuracy and adhesive process control replace conventional soldering entirely; layup sequence differs |
| Shingled (any route) | Electrically conductive adhesive bonding of overlapped cell strips | ECA dispensing accuracy, cure profile and cell cutting edge quality become primary yield drivers |
Module bill of materials interacts with line design more than is usually acknowledged. n-type cells and glass-glass constructions have pushed encapsulant selection toward POE and co-extruded films for their resistance to potential-induced degradation and to acetic acid generation, and each film carries its own lamination profile. Glass-glass or glass-backsheet, framed or frameless, 182 mm or 210 mm derived module sizes: each of these changes the laminator recipe, the framing station and the flash test fixture.
This is the general arrangement drawing for an integrated module line engineered to run TOPCon, back contact and HJT product on the same floor, with a MOM layer above it. The AGV transport routes are highlighted running the full length of the line, designed in as dedicated corridors rather than left as whatever floor space survived the equipment layout.
It is the clearest illustration of what multi-technology capability actually costs in floor space and equipment, and of why the cell route has to be settled before the module line layout is frozen.
Scroll sideways to follow the full length of the line
Drawing redrawn in the SIEMER palette from the original engineering general arrangement. Shown for scale and arrangement; dimensions and equipment schedules are issued under NDA.
Shared handling and services where the routes overlap, dedicated stations where they do not, so a change of technology does not mean a change of building.
The highlighted corridors run the full length of the line, with load-port docking positions designed in from the start rather than fitted around the equipment afterwards.
Operations management above the line from the outset, giving unit-level traceability across all three product routes.
Module value accumulates fast. A defect caught before lamination costs a cell string; the same defect caught after lamination costs the whole module.
Cracks and broken interconnections detected while the laminate can still be reworked.
Verification that the lamination cycle itself introduced no damage.
Automated optical inspection for cosmetic defects and alignment tolerance.
Bifacial I-V power classification plus HiPot and insulation verification.
Tell us your target capacity, technology route and site conditions, and our engineering team will respond with a concrete line configuration.